Dealing with hierarchical partitioning in bottom-up design methodologies
Conference: SMACD / PRIME 2021 - International Conference on SMACD and 16th Conference on PRIME
07/19/2021 - 07/22/2021 at online
Proceedings: SMACD / PRIME 2021
Pages: 4Language: englishTyp: PDF
Authors:
Passos, F. (Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Sevilla, Spain & Instituto de Telecomunicações, Lisboa, Portugal)
Saraza-Canflanca, Pablo; Castro-Lopez, Rafael; Roca, Elisenda; Fernandez, Francisco V. (Instituto de Microelectrónica de Sevilla, IMSE-CNM (CSIC/Universidad de Sevilla), Sevilla, Spain)
Abstract:
This paper deals with the expertise blend of circuit design and design methodology development required to successfully address hierarchical partitioning of analog, radiofrequency and mm-Wave circuits in bottom-up design methodologies. A set of guidelines for the optimal configuration of the bottom-up process is discussed. Two case studies are used to demonstrate that these guidelines yield sound design results.