Place and bend assembly of photonic modules

Conference: MikroSystemTechnik Kongress 2023 - Kongress
10/23/2023 - 10/25/2023 at Dresden, Deutschland

Proceedings: MikroSystemTechnik Kongress 2023

Pages: 3Language: englishTyp: PDF

Authors:
Grueger, Heinrich; Knobbe, Jens; Koch, Sandro G. (Fraunhofer IPMS, Dresden, Germany)
Schulz, Marlon; Sdrenka, Sebastian (Clausthaler Zentrum für Materialtechnik, TU Clausthal, Clausthal, Germany)
Ziegmann, Gerhard (Institut für Polymerwerkstoffe und Kunststofftechnik, TU Clausthal, Clausthal, Germany)

Abstract:
The integration of complex optical systems can be challenging, especially for off-axis designs. Fraunhofer IPMS invented a concept to integrate such systems by placing the optical components on a mostly planar substrate featuring preprocessed bending lines. Folding up the walls generates the body with the optical path inside. The method has been called “place and bend assembly”. After finishing the proof of concept using 3D printed substrates, now the development of injection-molded structures has been started. It is aimed to integrate functional and optical surfaces directly into the substrates as well as to cut down the system effort furthermore.