Lebensdauerprognostik für Drahtbond-Verbindungen mittels der Life-Cycle-Unit
Conference: Elektronische Baugruppen - Aufbau und Fertigungstechnik - Erfolg durch Innovation - 3. DVS/GMM-Fachtagung
02/08/2006 - 02/09/2006 at Seeheim, Germany
Proceedings: Elektronische Baugruppen - Aufbau und Fertigungstechnik - Erfolg durch Innovation
Pages: 6Language: germanTyp: PDF
Personal VDE Members are entitled to a 10% discount on this title
Authors:
Middendorf, A.; Reichl, H. (Technische Universität Berlin, Gustav-Meyer-Allee 25, 13355 Berlin)
Griese, H. (Fraunhofer IZM Berlin, Gustav-Meyer-Allee 25, 13355 Berlin)
Abstract:
Information on product use conditions is essential for sound strategies of product service as well as takeback, refurbishing, reuse of components, or recycling. Furthermore such information could improve future product design, market research and quality management. This paper describes a modular concept for life-cycle monitoring, as well as the identification of use conditions, reliability assessment and diagnosis of Insulated Gate Bipolar Transistors (IGBT) with a focus on the wire bond interconnections.