Zuverlässigkeit und Entwurf
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Failure Analysis of Soft Defects: Test and Localization Strategies

Conference: Zuverlässigkeit und Entwurf - 1. GMM/GI/ITG-Fachtagung
03/26/2007 - 03/28/2007 at München, Germany

Proceedings: Zuverlässigkeit und Entwurf

Pages: 2Language: englishTyp: PDF

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Authors:
Burmer, Christian; Brillert, Christof; Qian, Zhongling (Infineon AG, Munich)

Abstract:
On advanced logic ICs in sub-100nm technology there is a growing number of analysis requests with so called soft defects. Characteristic for these defects is their parameter dependence. Different strategies and tools have been developed in failure analysis in order to localize and find the root cause of the failure.