Laser Trimming of Micro Mirror Devices

Conference: Technologien und Werkstoffe der Mikro- und Nanosystemtechnik - 1. GMM-Workshop
05/07/2007 - 05/08/2007 at Karlsruhe, Germany

Proceedings: Technologien und Werkstoffe der Mikro- und Nanosystemtechnik

Pages: 4Language: englishTyp: PDF

Personal VDE Members are entitled to a 10% discount on this title

Hänel, Jens; Keiper, Bernd; Bleul, Karsten (D-Micromac AG, Chemnitz, Germany)
Kaufmann, Christian; Bonitz, Jens (TU-Chemnitz, Center for Microtechnologies, Germany)

Laser trimming of Micro Mirror Devices promises an increasing yield in microsystem technology. Therefore the 3D-Micromac AG and the Center for Microtechnologies (ZfM) have developed a module for measuring and tuning silicon micro actuators as well as microstructures. By using an ultra short pulsed laser with an UV-wavelength the cutting of previously etched mass trimming elements and beam stiffness trimming elements has been implemented. These elements for modifying the resonant frequency of the micro mirror device are cut off by removing of silicon connector bars. The resonant frequency was influenced successfully by using this laser trimming tool in a clean room environment at wafer level and the subsequent bonding process of the wafer was demonstrated.