Non-destructive strength characterization of wafer-bonded micromechanical components
Conference: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10/10/2005 - 10/12/2005 at Munich, Germany
Proceedings: Mikrosystemtechnik Kongress 2005
Pages: 4Language: englishTyp: PDF
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Authors:
Rabold, Martin; Doll, Alexander; Goldschmidtböing, Frank; Woias, Peter (Laboratory for Design of Microsystems, Institute of Microsystem Technology (IMTEK), University of Freiburg, Germany)
Abstract:
This article presents a novel test method for a non-destructive strength characterization of bonded silicon wafer pairs. The test relies on a controlled crack generation at the bond interface using a modified blister test method. An analytical model was used to establish an essential design parameter. Different test structures were analyzed to obtain the optimal geometry. Thus, important information about crack generation and crack propagation were gained and applied in a novel test structure. Finally, the theory of controlled crack generation was demonstrated with a modified blister test.