Mikrosystemtechnik Kongress 2005
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Silicon Microneedle Formation Using Modified Mask Designs Based on Convex Corner Undercut

Conference: Mikrosystemtechnik Kongress 2005 - Mikrosystemtechnik Kongress 2005
10/10/2005 - 10/12/2005 at Munich, Germany

Proceedings: Mikrosystemtechnik Kongress 2005

Pages: 4Language: englishTyp: PDF

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Authors:
Wilke, N.; Hoffmann, D.; Monissey, A. (Tyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland)

Abstract:
In this work we present the mechanism of silicon convex corner undercutting for modified etch masks in aqueous KOH solution (29 % KOH, 79deg C) during rnicroneedle fabrication. Modified mask designs include three different shapes as well as different compensation structures employed to a square mask shape. We have found that square mask-shapes present an optimum structure in contrast to circular or diamond shapes. The use of compensation structures facilitates an increase in needle density of 33 % to 40 %.