Evaluation of Substrate Technologies under High Temperature Cycling
Conference: CIPS 2006 - 4th International Conference on Integrated Power Systems
06/07/2006 - 06/09/2006 at Naples, Italy
Proceedings: CIPS 2006
Pages: 6Language: englishTyp: PDF
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Authors:
Dupont, Laurent (SATIE/INRETS/ISP3D, France)
Lefebvre, Stéphane (SATIE/ISP3D, ENS-Cachan, France)
Khatir, Zoubir (INRETS/ISP3D, France)
Bontemps, Serge (APT Europe, France)
Abstract:
This paper presents experimental results on the influence of different structures of ceramic substrates under very high temperature cycles. Test vehicles have been realised by APT Europe. Especially, DCB metallization thickness effects are pointed out in the ceramic fracture and solder delamination due to the high temperature variations. Special substrates, like DAB and Si3N4, are also investigated and compared to classical DCBs. Finally, the paper compares the different technologies under high temperature cycles, in order to identify the main factors that could increase the lifetime expectancy of power modules in such harsh environments.