Failure Mechanisms in SiC Power Module Interconnects

Conference: CIPS 2006 - 4th International Conference on Integrated Power Systems
06/07/2006 - 06/09/2006 at Naples, Italy

Proceedings: CIPS 2006

Pages: 6Language: englishTyp: PDF

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McCluskey, F. P.; Meyyappan, K.; Hansen, P. (CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD)

Solid-state power modules are subjected to harsh environmental and operational loads. Identifying the potential weak-links and dominant failure mechanisms is very critical to designing reliable power modules. This paper presents the PoF (Physics of Failure) based approach to determine the stresses/strains and the damage arising due to the thermo-mechanical loads in some of the critical failure sites identified in typical power modules.