Magnetic component miniaturisation for application in power electronic modules
Conference: CIPS 2006 - 4th International Conference on Integrated Power Systems
06/07/2006 - 06/09/2006 at Naples, Italy
Proceedings: CIPS 2006
Pages: 6Language: englishTyp: PDF
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Authors:
Gerber, M.; Ferreira, J. A. (EWI Faculty, Delft Technical University, Mekelweg 4, 2600 GA Delft, The Netherlands)
Seliger, N. (Siemens AG Corporate Technology, CT PS 2, Otto Hahn Ring 6, D-81730 Munich, Germany)
Hofsajer, I. W. (Industry Electronics Technology Research Group, University of Johannesburg, Kingsway, Auckland Park, 2006, Republic of South Africa)
Abstract:
As the specifications, functionality and level of integration in power electronic systems continues to increase, passive components will also be implemented within the semiconductor module to form an Integrated System Module. An Integrated System Module is a power electronic module that contains the complete energy processing circuit, including all passives instead of just the switching devices. To achieve a power electronic system with a high power density within the power electronic module, the volume of the required passive components and their associated thermal management structures must be minimised for the given energy storage requirements. This paper considers the electric, volumetric and thermal optimisation of a planar inductor and its thermal management structure for implementation in a high power density, high temperature Integrated System Module. Two inductor prototype structures with a current density of 15A/mm2 and 40A/mm2 each and a corresponding temperature rise of 18deg C and 31deg C respectively are built and experimentally verified.