Aerial Imaging Performance of ALTA4700 Printed Mask for 130nm Design Rule
Conference: EMLC 2007 - 23rd European Mask and Lithography Conference
01/22/2007 - 01/26/2007 at Grenoble, France
Proceedings: EMLC 2007
Pages: 10Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Hsu, Jyh Wei; Wu, Chun Hung; Cheng, Kevin (Taiwan Mask Corporation, Science-Based Industrial Park, Hsinchu 300, Taiwan)
Photomask plays a key role in optical lithography. Laser pattern generators are widely used for photomask manufacturing due to their high throughput. However, corner rounding and line-end shortening degrade pattern fidelity resulting in distorted pattern image s on wafer. ALTA4700 incorporates a new 0.9 NA, 42X reduction lens that significantly improves resolution and pattern accuracy performance. In this study, three critical line/space 130nm technology device patterns are printed by ALTA4700 laser pattern generator. Input data for these layers was based on existing OPC model generated for e-beam pattern generator. ALTA4700 printed masks have the same aerial image performance compare with e-beam pattern generator.