Resist and BARC organic outgassing measured by TD-GCMS: Investigation during the exposure or the bake steps of the lithographic process

Conference: EMLC 2007 - 23rd European Mask and Lithography Conference
01/22/2007 - 01/26/2007 at Grenoble, France

Proceedings: EMLC 2007

Pages: 9Language: englishTyp: PDF

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Tiron, Raluca; Sourd, Claire; Fontaine, Hervé; Cetre, Sylviane (CEA, LETI, 17 avenue des martyrs, 38054 GRENOBLE Cedex 9, France)
Mortini, Bénédicte (STMicroelectronics, 850 rue Jean Monnet, 38926 Crolles Cedex, France)

In this paper we develop a methodology in order to monitor the organic outgassing level of BARC and resist materials, during the exposure or bake steps of the lithographic process. We present two different approaches, both based on thermal desorption-gas chromatography/mass spectrometry (TD-GC/MS) techniques. First we used an indirect method to monitor the byproducts outgassed during the exposure step. Secondly we check with an in-situ measurement the outgassing behaviour as a function of bake conditions. These two approaches are illustrated using different resist and BARC formulations. Finally, TD-GC-MS technique is integrated in a largest outgassing evaluation protocol, and results obtained by this technique are correlated with other characterization methods such as TGA, FTIR and defectivity monitoring.