Challenges of residual layer minimisation in thermal nanoimprint lithography
Conference: EMLC 2007 - 23rd European Mask and Lithography Conference
01/22/2007 - 01/26/2007 at Grenoble, France
Proceedings: EMLC 2007
Pages: 6Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Bogdanski, Nicolas; Wissen, Matthias; Möllenbeck, Saskia; Scheer, Hella-Christin (University of Wuppertal, Rainer-Gruenter-Str 21, D-42119 Wuppertal, Germany)
When minimal residual layers are aimed at in the field of thermal imprint lithography (T-NIL) 'partial cavity filling' offers a promising method to succeed. There, a filling of any of the cavities a stamp provides is avoided by a reduction of the initial layer thickness. Due to this unusual procedure, some challenges evolve during the imprint of complex types of structures. We report about effects that go along with partial cavity filling like physical self assembly and recovery. Furthermore we will give some suggestions how they may be reduced or even can be avoided.