Bowers, John E.; Park, Hyundai; Fang, Alexander W.; Kuo, Ying-hao (Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara)
Jones, Richard; Paniccia, Mario J. (Intel Corporation, 2200 Mission College Boulevard, SC12-326, Santa Clara)
Cohen, Oded; Raday, Omri (Intel Corporation, SBI Park Har Hotzvim, Jerusalem, 91031, Israel)
Silicon evanescent lasers and amplifiers have been demonstrated utilizing low temperature wafer bonding technology. This approach enables the creation of high performance, small footprint active devices on silicon for photonic integrated circuits.