MEMS Characterization Technique Based on Special Designed Test-Structures

Abstract:
The paper presents an advanced technique for monitoring of MEMS manufacturing that is based on teststructures. It utilizes a data fusion process that combines numerically calculated and experimentally determined data to estimate geometrical and material properties. A proof of the concept based on first examples of teststructures is shown. This advanced technique is capable to characterize typical technological impacts on geometry and material property, like mask-undercut, sidewall-angles and mechanical stress. It enables efficient in-situ and non-destructive MEMS manufacturing monitoring on wafer level.