Impact of a High Pressure Micro Jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing
Conference: ICPT 2007 - International Conference on Planarization / CMP Technology
10/25/2007 - 10/27/2007 at Dresden, Germany
Proceedings: ICPT 2007
Pages: 6Language: englishTyp: PDF
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Authors:
Miyachi, Keiji; Seike, Yoshiyuki (New components division, Asahi Sunac Corporation, 5050 Asahimae-cho, Owariasahi, Aichi, 488-8688, Japan)
Haba, Shinichi (Technology, R&D division, Nitta Haas Incorporated, 3-17-1, Kannabidai, Kyotanabe-shi, Kyoto, 610-0333, Japan)
Kurokawa, Syuhei; Doi, Toshiro K. (Dept. of Intelligent Machinery & Systems Faculty of Engineering, Kyushu University, 744 Motooka, Nishi-ku, Fukuoka 819-0395, Japan)
Abstract:
A novel conditioning technique using High Pressure Micro-Jet (HPMJ) with ultra pure water pressurized to 3-20 MPa was applied to unwoven fabric polyester pads to be used for silicon wafer CMP. In this study, HPMJ conditioning was compared between “no conditioning” and “brush conditioning”, evaluating their performances by the removal rates, pad surface observations and SEM images. Rremoval rates of “no conditioning” and “brush conditioning” decreased due to clogging of the pad surfaces as number of polishing increased. The removal rates of HPMJ conditioning were 30 % higher than the brush conditioning when 20 wafers were polished. As a result, it has been confirmed that HPMJ is the most effective conditioning for unwoven fabric polyester pads in silicon polishing process.