Laser Scattering Technique for Characterizing Defects and Surface Morphology in the Fixed Abrasive CMP Process
Conference: ICPT 2007 - International Conference on Planarization / CMP Technology
10/25/2007 - 10/27/2007 at Dresden, Germany
Proceedings: ICPT 2007
Pages: 5Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Mahajan, Uday; Zhang, Haiping; Douglas, Carlotte (KLA-Tencor Corporation, Milpitas, CA 95035, USA)
Gagliardi, John; Olson, Erik (3M Corporation, St. Paul, MN 55144, USA)
In this study, laser scattering technology was evaluated for defectivity and surface characterization of a Fixed Abrasive (FA) CMP process. Light Point Defect (LPD) and micro-haze measurements from a KLA-Tencor Surfscan SP2 were used to characterize the performance of different FA CMP process conditions, and the results were compared against a conventional High Selectivity Slurry (HSS) process. The results show that laser scattering is an effective methodology for obtaining full-wafer defect and surface condition information at high throughput.