Reliability Improvement in Smart Systems Integration
Conference: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
04/09/2008 - 04/10/2008 at Barcelona, Spain
Proceedings: Smart Systems Integration 2008
Pages: 8Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Hertl, Michael; Lecomte, Jean-Claude; Weidmann, Diane (Insidix, 24 rue du Drac, 38180 Seyssins, France)
Today developers in the field of smart integrated systems are facing reliability demands from customers asking for zero defect quality. Besides increasing costs and efforts to achieve this reliability level, even the classical technologies for reliability assessment are challenged. The current experimental failure characterization technologies all follow a post-mortem approach: Technologies like xray imaging (XCT) or scanning acoustic microscopy (SAM) only detect failure modes where the sample is already physically damaged. Thus with decreasing failure probability, a lot of time and effort is wasted in waiting for the manifestation of failures that are supposed not to happen.