Ultra small system-in-package for medical applications
Conference: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
04/09/2008 - 04/10/2008 at Barcelona, Spain
Proceedings: Smart Systems Integration 2008
Pages: 7Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Couderc, Pascal; Val, Christian (D PLUS 641 rue Hélène-Boucher, 78532 Buc France)
The fantastic development of the components interconnection allows to imagine « Systems in Package » of around a few mm3, which opens new perspectives for medical applications. Since the use of hybrid modules, then Multichip Modules « MCM » which were identical to the previous ones but named differently, the coming of the interconnection in 3-D allowed to divide both the volume and weight of a module by a factor comprised between 25 and more than 100.