A Multilayer Process for the Connection of Fine-Pitch-Elements on Three-Dimensionally Molded Interconnect Devices (3D-MIDs)
Conference: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
04/09/2008 - 04/10/2008 at Barcelona, Spain
Proceedings: Smart Systems Integration 2008
Pages: 3Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Leneke, Thomas; Majcherek, Soeren; Hirsch, Soeren; Schmidt, Bertram (IMOS-TEPROSA – Otto-von-Guericke-University of Magdeburg, P.O. Box 4120, 39016 Magdeburg, Germany)
The technological progress leads to miniaturized systems with a high level of integration and sophisticated functions. Most challenging for the assembly is to provide all necessary functionalities (electrical connections, shielding, housing, mechanical support, thermal management, etc.) in size decreasing overall-systems. 3D-MIDs exhibit an excellent potential to fulfill these requirements. In this paper we present a new multilayer 3D-MID process based on injection molding and suitable for the assembly of fine pitch semiconductor packages like BGAs, MCMs, CSPs or bare dies on 3D-MIDs.