Analysis of Thermomechanical Stress in Bare Die Assemblies on Polymer Substrates
Conference: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
04/09/2008 - 04/10/2008 at Barcelona, Spain
Proceedings: Smart Systems Integration 2008
Pages: 3Language: englishTyp: PDF
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Authors:
Majcherek, Soeren; Leneke, Thomas; Hirsch, Soeren; Schmidt, Bertram (IMOS-TEPROSA – Otto-von-Guericke University of Magdeburg, P.O. Box 4120, 39016 Magdeburg, Germany)
Abstract:
This paper reports on a method for the measurement of packaging induced thermomechanical stress. The thermomechanical influence on MEMS sensor and actuator structures which were assembled on substrates made of new polymers for the 3D molded interconnect device (3D-MID) technology was researched. Finite element analysis was used to calculate the stress profile with different packaging materials and different packaging geometries. Afterwards, experimental tests were done to validate the simulation results.