Achievements and perspectives of the DRIE technology for the Microsystems
Conference: Smart Systems Integration 2008 - 2nd European Conference & Exhibition on Integration Issues of Miniaturized Systems - MOMS, MOEMS, ICS and Electronic Components
04/09/2008 - 04/10/2008 at Barcelona, Spain
Proceedings: Smart Systems Integration 2008
Pages: 3Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Puech, M.; Thevenoud, J. M.; Gruffat, J. M.; Launay, N.; Godinat, P.; Barillec, O. Le (Alcatel Micro Machining Systems, Annecy, France)
More than a decade ago, DRIE (Deep Reactive Ion Etching) of silicon appeared as a key enabling technology for the emerging MEMS industry. Derived from the semiconductor plasma etching tools, the DRIE has been adapted to the specific needs of the micro-machining of silicon involved in the structuring of large and high aspect ratio features.