Vertical Integration Power Modules for Double Sided Cooling Applications using Aluminum Conductors and Thick Film Dielectrics

Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2014

Pages: 8Language: englishTyp: PDF

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Burns, Robert Christopher (AB-Mikroelektronik GmbH, Austria)

In order to increase the power density while decreasing footprint and cost for power modules, double sided modules will become an inevitable way forward for the power module industry. The challenges, advantages, and manufacturability of a vertical chip stacked power module for double sided cooling applications by using low cost materials and flexible processes are presented, highlighting some of the most critical environmental testing challenges for the automotive industry as well as challenges in electrical schematic designs. Thermal mechanical stress, thick film dielectric breakdown voltage, stray inductance, and thermal resistance will be discussed in further detail as well as some of the benefits of a high performance and cost effective power module.