p2 Pack - the Paradigm Shift in Interconnect Technology
Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2014
Pages: 9Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Gottwald, Thomas; Roessle, Christian (Schweizer Electronic AG, Einsteinstr. 10, 78713 Schramberg, Germany)
Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. With the p² Pack technology it is possible to build ultra-thin modules with a thickness of 1-1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.