p2 Pack - the Paradigm Shift in Interconnect Technology

Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2014

Pages: 9Language: englishTyp: PDF

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Gottwald, Thomas; Roessle, Christian (Schweizer Electronic AG, Einsteinstr. 10, 78713 Schramberg, Germany)

Miniaturization of Power Electronic modules requires the minimization of losses and optimized power dissipation. With the p² Pack technology it is possible to build ultra-thin modules with a thickness of 1-1.4 mm which have less losses and improved power dissipation characteristics by using embedding technologies and processes of the Printed Circuit Board industry.