Reliability Improvement of Large Area Soldering Connections by Antimony Containing Lead-Free Solder

Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2014

Pages: 8Language: englishTyp: PDF

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Beyer, H.; Sivasubramaniam, V.; Hajas, D.; Nanser, E. (ABB Switzerland Ltd., Semiconductors, Switzerland)
Brem, F. (ABB Switzerland Ltd., Corporate Research, Switzerland)

Power semiconductor modules typically undergo extreme thermal excursions, which require reliable large area solder connections. Here antimony (Sb) containing lead-free solders are promising candidates providing very good thermo-mechanical properties. In this work mechanical and microstructural investigations of soldering connections between Ni(P) plated AlSiC baseplates and ceramic substrates using lead-free solders Sn5Sb and Sn8Sb are presented. The metallization for the ceramic substrates were bare copper and NiAu coated copper metallization. Overall results of antimony containing lead-free solders are compared with baseline solders - 62Sn36Pb2Ag and lead-free Sn-Ag-Cu (SAC) solders. The antimony containing lead-free solders exhibit significantly higher shear strength and ductility at ‘as soldered’ condition compared to the baseline solders. After subsequent isothermal aging at high temperature, antimony containing lead-free solders maintain their superior shear strength with good ductility. The sustainance of shear strength and ductility even after high temperature aging suggests, that the reliability of Sn-Sb solders is superior over 62Sn36Pb2Ag and lead-free Sn-Ag-Cu (SAC) solders.