Dual-sided Cooling of Power Semiconductor Modules

Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2014

Pages: 7Language: englishTyp: PDF

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Marcinkowski, Jacek (International Rectifier, 101 N. Sepulveda Blvd, El Segundo, CA 90245, USA)

The paper presents analysis results of thermal performance of a new concept in high power semiconductor packaging technology developed for electric and hybrid-electric vehicle (EV and HEV) traction inverter applications. Different implementations of thermal stack of the power modules are discussed and analysis results are presented. Analysed configurations include conventional solutions such as die on DBC with and without baseplate as well as with direct liquid cooling. The analysis leads to a conclusion that incremental improvements of the heat transfer capabilities of power module packaging technologies are inadequate and a paradigm change is needed in order to meet the power density and cost reduction challenges of the EV and HEV inverters. Dual-sided cooling offers the opportunity to make a decisive, discontinuous progress rather than small step improvements. The paper discusses how the novel dual-side cooled packaging platform being developed by International Rectifier eliminates the weaknesses of conventional packaging technologies and enables significant improvements in thermal performance and allows for inverter system cost savings and reliability improvements. Possible performance improvements over traditional power module packaging technologies are discussed and analysis results showing increased capabilities such as approx. 60% increase in current rating of power modules are presented.