Next-gen IGBT module structure for hybrid vehicle with high cooling performance and high temperature operation
Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2014
Pages: 8Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Gohara, Hiromichi; Nishimura, Yoshitaka; Morozumi, Akira; Mochizuki, Eiji; Takahashi, Yoshikazu (Fuji Electric Co., Ltd, 4-18-1, Tsukama, Matsumoto, Nagano, Japan)
Dietrich, Peter (Fuji Electric Europe GmbH., Geothering 58. 63067 Offenbach, Germany)
Trends of the Power module for hybrid vehicle are high effective, downsizing, lightweight and higher reliability. To achieve these requirements, IGBT module needs low thermal resistance and high operating temperature. In this paper, we developed new technologies. One technology is the cooling structures which has a direct liquid cooling structure with a solder-joined aluminum heat sink. The module achieves a 30-% volume reduction and a 60-% weight reduction compared to our conventional models. A heat sink with high cooling capacity and a high-strength solder were newly developed to establish the structure. And other is the maximum junction temperature, Tjmax = 175oC continuous operation with automotive required quality. We have applied these new technologies to the next-gen IGBT module for hybrid vehicle application.