Evaluation of phase change thermal interface materials for power modules performance enhancement
Conference: PCIM Europe 2014 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/20/2014 - 05/22/2014 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2014
Pages: 8Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Basler, Anthony; Bontemps, Serge; Salland, Matthieu (Microsemi Power Modules Products, France)
This paper evaluates several phase change thermal interface materials available in sheet form on the market from major suppliers. A large power resistor module is designed to feature homogeneous power dissipation over a large area. The temperature of the device is monitored with an infrared camera and the case to heat sink thermal resistance is determined from the difference between case and heat sink temperature and the power dissipated by the resistor. The different materials tested are compared with thermal grease, no thermal interface and thermal material used in paste instead of sheet.