The Improvement of High Temperature Zn- Based Lead Free Solder by the Application of Besi’s Programmable Ultrasonic Module (PUM)
Conference: PCIM Asia 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/24/2015 - 06/26/2015 at Shanghai, China
Proceedings: PCIM Asia 2015
Pages: 9Language: englishTyp: PDF
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Authors:
Wu, Xiaodan; Li, Jianxing (Honeywell Electronic Materials, 15128 E. Euclid Ave., Spokane Valley, WA 99216, USA)
Xi, Hyo (Honeywell Co., Ltd 30 Li Bing Rd, Zhangjiang Hi-Tech Park, Pudong, Shanghai, 201203, China)
Galea, Charles; Berchtold, Heinrich (Besi Switzerland AG, Hinterbergstrasse 32A, 6330 Cham, Switzerland)
Unuvar, Tora (Honeywell Electronic Materials, 6760 W Chicago St, Chandler, AZ 85226, USA)
Abstract:
Researchers have been working for many years on a Pb-free alternative in soft solder die attach application to comply with the European regulations regarding the use of high-Pb solders in electronics. As of now, Zn-based Pb-free solder has shown to be a very promising substitute to high-Pb solders. A previous study demonstrated that a Zn-based solder with a melting temperature above 330deg C and excellent thermal and electrical properties may serve as a near drop-in alternative to high-Pb solder wire in die attach applications. This paper focuses on further improvements with regards to wettability and reliability of the Zn-based solder by the application of Besi’s Programmable Ultrasonic Module (PUM) available on Esec 2009 SSI(exp E) and 2009 fS(exp E) die bonders.