A New IGBT Module with Insulated Metal Baseplate(IMB) and 7th Generation Chips
Conference: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/19/2015 - 05/20/2015 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2015
Pages: 4Language: englishTyp: PDFPersonal VDE Members are entitled to a 10% discount on this title
Ohara, Kota; Masumoto, Hiroyuki; Takahashi, Takuya; Manabu Matsumoto,; Otsubo, Yoshitaka (Power Device Works, Mitsubishi Electric Corp., Japan)
In this paper, a highly reliable IGBT module employing newly developed IMB(insulated metal baseplate) and 7th generation chips is presented. IMB, which consists of insulating resin sheet with high thermal conductivity, copper baseplate and thick copper foil, realizes good heat dissipation and the needed isolation voltage. Also, by adopting IMB, thermal cycling is enhanced and the effective area of chip mounting increased by 23%. By introducing direct potting resin, power cycling and gas barrier performance are improved. The module integrates 7th generation CSTBTTM IGBT and diode. Eoff of proposed IGBT module realized a reduction of 20% by the suppression of tail current.