New Transfer-Molded SLIMDIP for white goods using thin RC-IGBT with a CSTBTTM structure
Conference: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/19/2015 - 05/20/2015 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2015
Pages: 6Language: englishTyp: PDF
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Authors:
Shibata, Shogo; Kato, Masahiro; Zhang, Hongbo (Power Device Works, Mitsubishi Electric Corporation, Japan)
Abstract:
The newly developed SLIMDIP series power module using for inverter drived home airconditioner, washing machine, refrigerator and other white goods is introduced in this paper. In this new module, 600V class super thin wafer technology and integration of IGBT and FWD into one chip structure, which is the so-called RC-IGBT are employed, resulting in greatly space saving compared with either conventional DIPIPMTM or even discrete configuration. The SLIMDIP is suitable for less than 1.5kW motor drive realized by a package size of 32.8mm×18.8mm.