Sn+ Heat-Spring® Solder TIMs for Superior Thermal Management in IGBT Power Modules
Conference: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/19/2015 - 05/20/2015 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2015
Pages: 5Language: englishTyp: PDF
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Authors:
Wilson, Graham (Indium Corporation, UK)
Jarrett, Bob (Indium Corporation, USA)
Abstract:
Thermal Interface Materials (TIMs) including Solder Heat-Spring(r) TIMs, PCMs and thermal greases - were characterized for thermal interface resistance and junction temperature for (a) Power Cycling - 1000 power cycles, 0-50 W, 3 minutes ON / 2 minutes OFF, ambient temperature; (b) Bake test: at 90deg C for 1500 and 3000 hours. In all the tests, Solder HeatSpring(r) TIMs consistently outperformed PCMs and thermal greases by achieving low thermal interface resistances and not experiencing pumpout/bakeout, especially over time, and prevented the power die from overheating.