Thermal Optimization within Power Packages for Automotive Applications
Conference: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/19/2015 - 05/20/2015 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2015
Pages: 5Language: englishTyp: PDF
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Authors:
Chen, Liu; Sander, Rainald; Schweitzer, Dirk (Infineon Technologies AG, Germany)
Abstract:
Thermal optimization within a power package is an endless quest to achieve lower operating temperature. This paper first investigates the correlation between various package features and their time intervals of maximum influence on the thermal impedance (Zth). It then analyses the cooling efficiency of a few optimized structures in typical automotive applications, such as short-circuit, filament lamp inrush and motor inrush. This method should be used for any future assessment of new cooling methods.