3D electro-thermal simulation of multilayer power MOSFET structure under electro-thermal stress
Conference: PCIM Europe 2015 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/19/2015 - 05/20/2015 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2015
Pages: 6Language: englishTyp: PDF
Personal VDE Members are entitled to a 10% discount on this title
Authors:
Bazzano, Gaetano; Cavallaro, Daniela Grazia; Greco, Rosario; Raffa, Alessandra; Veneziano, Pier Paolo (STMicroelectronics, Italy)
Abstract:
In this work a 3D electro-thermal-mechanical simulation by a Finite Element Model (FEM) using COMSOL Multiphysics is used to investigate the robustness of a multilayer power MOSFET structure under electro-thermal stress. Thermal, stress and strain maps obtained by simulation help to identify the critical layers and to evaluate the reliability of the power component.