New High Level Integrated Intelligent Power Module with Three Phase Inverter and Power Factor Correction Topologies Optimized for Home Appliances
Conference: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2016 - 05/12/2016 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2016
Pages: 8Language: englishTyp: PDF
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Authors:
Jang, Hyosang; Choo, Byoungho; Lee, Junbae; Lee, Minsub; Chung, Daewoong (Infineon Technologies Power Semitech, Korea)
Abstract:
This paper introduces a new high level integrated IPM (Intelligent Power Module) with a three phase inverter and a power factor correction (PFC) topology optimized for home appliance applications. A three phase Inverter and a single boost PFC stage are integrated in a single miniaturized DIL (Dual-In-Line) transfer molded type package. The inverter stage is built with six 600V rated TRENCHSTOP(TM) IGBTs, six Emitter Controlled Diodes and a SOI (Silicon On Insulator) gate driver. The PFC stage consists of a 650V rated TRENCHSTOP(TM) IGBT and a 650V rated Rapid Switching Emitter Controlled Diode which has fast and soft switching characteristics. 650V of voltage rating provides higher reliability and ruggedness for a PFC topology [1]. DCB (Direct Copper Bond) substrate is adopted for good thermal performance considering small package size. This paper provides an overall description of the new IPM as well as performance, power ratings and characteristics of semiconductors built in the module. Using this new IPM, reduced PCB and heatsink size and simplified assembly process can also be achieved.