Improvement of system level power density of 15A/600V intelligent power modules
Conference: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2016 - 05/12/2016 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2016
Pages: 5Language: englishTyp: PDF
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Authors:
Harper, Jonathan (ON Semiconductor GmbH, Zamdorferstr, 100, 81677 Munich, Germany)
Abstract:
A novel approach to implementing a 15A/600V intelligent power module using a new type of DBC substrate is presented. The module is 40% smaller than other intelligent power modules having a similar current and voltage specification which use IMS, lead frames or other combinations of substrates in their construction. Despite the reduction in size, the thermal resistance of the package is 5% lower. Careful optimization of the IGBT and diode reduces the overall power losses by 5%.