A novel Transfer Molding Intelligent Converter Inverter Brake IGBT module (DIPIPM+) with integrated level shifting control ICs

Conference: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2016 - 05/12/2016 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2016

Pages: 6Language: englishTyp: PDF

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Authors:
Honsberg, Marco (Mitsubishi Electric Europe B.V., Mitsubishi Electric Platz 1, 40882 Ratingen, Germany)
Nagahara, Teruaki (Mitsubishi Electric Power Device Works, 1-1-1 Imajukuhigashi, Nishi-Ku, Fukuoka 819-0192 Japan)
Motto, Eric R. (POWEREX Inc. 173 Pavilion Lane, Youngwood, PA 15697 USA)

Abstract:
This paper introduces a new family of a compact intelligent CIB module and the specific design features of the used IGBT, Diodes and the High Voltage Integrated Circuit (HVIC). The module is manufactured in Transfer Mold technology which provides a good matching of mechanical expansion coefficients especially between the Copper lead frame and the mold material. The optimization of internal bond wiring provided better compactness of the module now being only slightly bigger than the standard DIPIPMTM and including a 3-phase input bridge rectifier and brake chopper topology. Test results of the switching performance and the related impact on the EMI are shown in a comparative analysis of EMI behavior of a previous generation DIPIPM versus the new DIPIPM+TM. As a test platform for this new intelligent power module with converter and brake the Evaluation Board for the new DIPIPM+TM module is introduced in this paper.