Pumping out failure free package structure
Conference: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2016 - 05/12/2016 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2016
Pages: 5Language: englishTyp: PDF
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Authors:
Yamada, Junji; Otsubo, Yoshitaka (Mitsubishi Electric Power Device Works, 1-1-1 Imajukuhigashi, Nishi-Ku, Fukuoka 819-0192, Japan)
Miyahara, Satoshi (Mitsubishi Electric Europe B.V., Mitsubishi-Electric-Platz 1, 40882 Ratingen, Germany)
Abstract:
This paper presents an advanced technology and its benefit for new power module structures which enable preventing pumping out failures of the thermal interface material between base plate of the module and the cooling fin. This benefit is realized by developing a packaging technology with a new structure which has less warpage of the base plate with change in temperature.