Nanosilver Paste for Low Pressure Die Attach: A Turn Key Process
Conference: PCIM Europe 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/10/2016 - 05/12/2016 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2016
Pages: 8Language: englishTyp: PDF
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Authors:
Masana, Francesc (Barcelona Semiconductors S.L.U., Sta Agnes 18, Pol. Ind. Sud, 08440 Cardedeu, Spain)
Abstract:
In this work, we present a new solder paste for die attach based on a bimodal nanosilver particle blend, with good mechanical, electrical and thermal characteristics. Also, in order to simplify processing while achieving a good repeatability and improved reliability, a sintering furnace has been developed providing the required control of sintering atmosphere, temperature, pressure and time in a programmed sequence with just the push of a button. The sintering proceeds under a vacuum of