Effect of solvents on sintering behaviors of silver paste for power-device packaging

Conference: PCIM Asia 2016 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
06/28/2016 - 06/30/2016 at Shanghai, China

Proceedings: PCIM Asia 2016

Pages: 7Language: englishTyp: PDF

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Zhang, Hao; Jiu, Jinting; Suganuma, Katsuaki (The Institute of Scientific and Industrial Research (ISIR), Osaka University, Mihogaoka 8-1, Ibaraki, Osaka 567-0047, Japan)
Suzuki, Youji; Akai, Yasuyuki (Daicel Corporation, 1239, shinzaike, aboshi-ku, Himeji, 671-1283, Japan)

The effect of a novel solent, CELTOL-IA, on sintering behaviors of micro-silver paste was studied to realize pressureless sintering at lower temperature. A bonding strength of above 30 MPa was achieved at 180 °C with these big silver particles. A low electrical resistivity of 8.45 muOmega · cm was also realized at the low temperature, which was superior to that of those nano-silver pastes. The special themal reaction of new solvent was attributed to the electrical and bonding performances. The new micro-silver paste could be a good candidate of expensive nano-Ag paste as die attaching material for high power device packaging.