Sintering Copper Die-Bonding Paste Curable Under PressurelessConditions
Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2017
Pages: 5Language: englishTyp: PDF
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Authors:
Nakako, Hideo; Ishikawa, Dai; Sugama, Chie; Kawana, Yuki; Negishi, Motohiro; Ejiri, Yoshinori (Hitachi Chemical, Japan)
Abstract:
We have developed a sintering copper die-bonding paste curable at a temperature of over 225 °C in a H2 atmosphere under pressureless conditions. The die-shear adhesive strengths observed for Cu, Ni, Au, Ag, and Pd adherends were greater than 40 MPa. The thermal conductivity of the sintered copper die-bonding layer was 180 W/m·K, allowing rapid heat release. Scanning acoustic tomography (SAT) images did not indicate significant changes when the material was subjected to 1500 cycles of the thermal cycle test (TCT) at a temperature range between -40 and 200 °C. The sintered copper die-bonding has a thermal cycle reliability comparable to or better than sintered silver die-bonding or high-lead solder. This sintering copper die-bonding paste could be an ideal die-bonding material that is simultaneously fulfilled high thermal conductivity, high bonding reliability, reasonable cost, and applicability to mass production.