A Double Side Cooled Electronic Power Module
Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2017
Pages: 8Language: englishTyp: PDF
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Authors:
Favre, Jacques (APSI3D, France)
Reynes, Jean-Michel (IRT Saint Exupery, France)
Fradin, Jean-Pierre; Cadile, Claudia; Sanchez, Sebastien; Elzo, Dominique (ICAM, France)
Marcault, Emmanuel (CEA Tech, France)
Abstract:
Double side cooling and wire-bondless interconnections are envisioned as ways to go for highly compact Electronic Power Modules. aPSI3D has developed an integrated approach for the design of such a power module. Prototypes have been manufactured and characterized in terms of electronics and thermo-fluidics. The parasitic self-inductance which involves the physical copper layers carrying the main current are significantly reduced, in agreement with previous simulations. An electro-thermal liquid cooled bench was fully developed by ICAM in order to extract the Power Module thermo-fluidic behavior. Thermal resistance are extracted and compared to simulations. During these characterizations, several material interfaces were identified as critical for the thermal behavior.