A Novel SiC Power Module with 3D Integration
Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2017
Pages: 5Language: englishTyp: PDF
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Authors:
Zhou, Jinchang (ON Semiconductor, USA)
Abstract:
A 3D stacked power module with interposer is introduced at the first time. Unlike conventional single sided structural or normal double-sided cooling modules, the power devices are stacked over and connected through interposer via in the module. The power density is greatly increased and module size is reduced. This module is featured with ultra-low parasitic, high operation temperature (> 200 °C), and low thermal resistance with double sided cooling. It is a great fit for SiC power module requirement. The process to manufacture such a module with high robustness, reliability as well as of process simplicity is addressed.