An Advanced Si-IGBT Chip for Delivering Maximum Overall System Performance

Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2017

Pages: 7Language: englishTyp: PDF

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Authors:
Lakshmanan, Narender; Radke, Thomas (Mitsubishi Electric Europe, Germany)

Abstract:
The quest to push the boundaries of semiconductor performance has witnessed the development of several generations of Si-IGBT chip technologies. The electrical loss performance of each new generation Si-IGBT chip appears to be better than its predecessor, however an analysis reveals that the electrical loss performance of the conventional Si-IGBT device is reaching a kind of ‘saturation situation’ where no further substantial improvement can be obtained. Another feature of the conventional Si-IGBT chip is the trade-off between Eon and switching dv/dt due to which it is not possible to achieve the best switching dv/dt during operation without having to compromise on efficiency (and vice-versa). It is thus imperative to explore the Si-IGBT chip technology for developing a device which is capable of delivering overall maximum performance – highest efficiency and the best possible switching dv/dt. Furthermore, another aspect requiring re-consideration is the electrical performance versus short-circuit robustness trade-off in the conventional Si-IGBT chip design, and accordingly Mitsubishi Electric has designed and developed an advanced Si-IGBT chip which is capable of achieving short- circuit robustness and excellent efficiency.