High Speed, Thermally Enhanced, Small Footprint SiC Power Modules for Cost Sensitive Applications

Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2017

Pages: 8Language: englishTyp: PDF

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Authors:
Barkley, Adam; Schupbach, Marcelo; Alan, Scott (Wolfspeed, USA)

Abstract:
Si-based power module cost reduction is typically achieved by material and/or assembly cost reduction rather than by chip area minimization as exemplified by a new generation of “baseplate-less” power modules. The per-area cost of SiC devices, however, is much higher than their Si counterparts and thus module cost is dominated by semiconductor cost rather than material/assembly costs. These two different cost structures change the way SiC-based modules should be designed and optimized. This paper presents a new design approach which delivers a superior SiC-based module with improved thermal and electrical performance and significant cost reduction when compared to presently available SiC-based baseplate-less modules.