Development of High Thermal Performance Automotive Power Module with Dual Sided Cooling Capability
Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2017
Pages: 5Language: englishTyp: PDF
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Authors:
Wang, Yangang; Li, Yun; Ma, Yaqing; Zhu, Shiwu; Jiao, Mingliang; Zhao, Zhenlong; Wu, Chundong; Wu, Yibo; Mumby-Croft, Paul; Booth, James; Packwood, Matthew; Jones, Steve; Dai, Xiaoping; Liu, Guoyou (State Key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou, Hunan, P. R. China)
Yu, Jun (State Key Laboratory of Advanced Power Semiconductor Devices, Zhuzhou, Hunan, China & Power Semiconductor R&D Centre, Dynex Semiconductor Ltd, Lincoln, UK)
Abstract:
Development of power module for driving hybrid and electric vehicles (HEV/EV) is generally regarded as one of the key challenging and promising activities for power semiconductor industry. The high electrical and thermal performance, high reliability with low weight/volume and cost effective products are required by automotive customers because of the harsh operating and market environments. Thermal performance is one of the critical factors limiting automotive power module development and application. Various solutions have been reported with fast growing of HEV/EV. In this work, development of a high thermal performance automotive power module with dual sided cooling capability is investigated. The concept, thermal design and manufacture are presented, by which the thermal, electrical and mechanical performance, as well as reliability are enhanced through simulation and test results.