Testing, Selecting, and Applying Metallic Thermal Interface Materials for Harsh Environment Applications

Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2017

Pages: 9Language: englishTyp: PDF

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Authors:
Saums, David (DSA LLC, USA)
Jensen, Timothy (Indium Corporation, USA)

Abstract:
Operating temperature control through a semiconductor device, package, and associated materials stack is an important determinant of device performance and reliability. A device must be maintained at or below the manufacturer’s specified maximum junction temperature (Tj), accomplished with selection of appropriate package and thermally-conductive materials and adequate heat dissipation to an external case or heat removal mechanism. Minimizing thermal resistance through the semiconductor package material stack and at the external case or package surface with an appropriate thermal interface material (TIM) is an important aspect of maintaining operating temperatures within specified maximum values. Thermal interface materials are available in an extremely broad range of categories, types, and intended use. Functions of TIMs are outlined and examples given of challenging environmental parameters in selected market segments. In addition to thermal performance, other factors enter the processes of development, evaluation and selection of new TIMs and must be understood. Continuing change in industry requirements creates need for awareness of why greater TIM specialization is occurring and new types are introduced below. Performance test data is shown for newer specialized metallic TIMs developed to meet challenging requirements from difficult application conditions.