Power Electronic Package for Double Sided Cooling Utilizing Tile-Level Assembly
Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland
Proceedings: PCIM Europe 2017
Pages: 7Language: englishTyp: PDF
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Authors:
Schmid, Maximilian; Pforr, Johannes; Elger, Gordon (Technical University of Applied Sciences Ingolstadt, Germany)
Abstract:
Double side cooling of high power modules brings huge advantages in thermal management and miniaturization. It's suitable for current semiconductor materials, but more important for the new wide bandgap materials with only small chip sizes and short switching times, which allow only small stray inductances. This paper discusses the advantages of different 3D-buildup concepts in comparison to a standard module and shows a possible assembly strategy with special concern on gate connection. Additional further investigation like hermetic sealing and integration in a FR4-PCB for driving components are discussed.