Passive and Active Two-Phase Cooling for Power Electronics Applications

Abstract:
As the demand for higher power density power electronic devices increases, the effective dissipation of the waste heat generated during operation becomes critical. Component operating temperatures have an effect on the maximum power handling capability of a given device and the expected reliability of the unit. Excessive module temperatures can result in significant reductions in power electronic device life expectancy and result in unwanted downtime of critical equipment. Existing air and liquid cooling solutions are approaching their usable limits and advanced cooling solutions are needed to continue to advance power electronic technologies and applications. This paper will describe the useable limits of various cooling solutions and the use of passive and active two-phase cooling technology to enable higher energy densities and improve device performance.