High Reliability Large Area Substrate Solder Interconnect by Embedded Mesh Technique

Conference: PCIM Europe 2017 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management
05/16/2017 - 05/18/2017 at Nürnberg, Deutschland

Proceedings: PCIM Europe 2017

Pages: 7Language: englishTyp: PDF

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Authors:
Booth, James; Varley, Michael; Slack, David; Mumby-Croft, Paul; Jones, Steve; Dai, Xiaoping (Dynex Semiconductor Ltd., UK)
Vijay, Karthik (Indium Corporation, UK)

Abstract:
This paper discusses reliability improvements in thermal fatigue to the solder layer between the substrate (Al2O3 ceramic) and baseplate (nickel plated copper) of power semiconductor modules. This includes (i) use of embedded mesh in the solder with earlier demonstrated improvement on bondline uniformity and thermal fatigue for AlN substrate with AlSiC baseplate modules; (ii) alternative solder alloy SnSb5. Passive thermal cycling tests compare samples with the embedded mesh to those with aluminum wire bond spacers (for bondline control). Joint degradation is monitored by SAM scanning. FEA (Finite Element Analysis) simulation is also carried out.